I am not sure if M3.1 has knock control, but it is not shown in the schematic since it appears to be ~50% complete.
Some of the chips are different in M1.7.3 and M1.7. S500 & S600 have different packages (going M1.7 to 1.7.3, S500 changes from 28-PLCC to 20-SOIC, and S600 changes from 24-SOIC to 28-PLCC). So I am assuming that I cannot use the same labels, for now.
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